Advanced design for 3D sensing! 20-zones addressable flip-chip VCSEL

iReach Corporation is a professional VCSEL (Vertical Cavity Surface Emitting Laser) design house which focuses on epitaxy design, chip design and the VCSEL component sales. iReach R&D team just announces wafer-fusion type, 20 to 80 zones addressable VCSEL Flip-Chip platform to aim the 3D sensing applications for consumer electronics. The patented and unique wafer-fusion flip-chip VCSEL technology can remove the very brittle and highly absorbent GaAs substrate to form a more manufacturing-friendly and higher efficient VCSEL Flip-Chip.

In 2021, iReach honorably got the approval of the subsidy program of new technology and application from Hsinchu Science Park Bureau. Project was named “High Power, High-modulation-frequency and Aperture-addressable VCSEL Flip-Chip Development”. Through the support, iReach team successfully accomplishes PCE 40.6%, 500MHz driving, and 20 zones addressable VCSEL Flip-Chip sample. Based on20% to 80% of the value, the rise time (Tr) is 331.1ps and fall time (Tf) is 271.1ps. Both of the values are at the leading edge of high power driving VCSEL for consumer electronics.

VCSEL Flip-Chip by iReach can achieve thinner package for saving the size and better heat dissipation for thermal management. Furthermore, 20-zones addressable sample is also the most controllable zones in the world wide. iReach also expects the function of addressable can create more applications and improve the sensing accuracy. This novel function should provide the new opportunity and path for the future sensing world.

• Fig.1. Single zone LIV curve
• Fig. 2. Single zone PCE curve

• Fig. 3. Single zone turn-on
• Fig. 4. Full zone turn-on
• Fig. 5. Half zone turn-on