iReach Corp. Partners with Brillink to Drive Scale-Up Revolution via Flip-Chip Micro VCSEL Arrays

Advanced Flip-Chip Micro VCSEL Array and High-Sensitivity APD Optical-Electro Engine Integration Resolves AI Bandwidth and Power Bottlenecks for 10m+ Optical Interconnects

Hsinchu, Taiwan, 11^th Aug. 2026— As parameter counts in generative AI models expand exponentially, single-GPU configurations can no longer meet processing demands. While clustered computing has become industry standard, it introduces severe physical limits: the Bandwidth Wall and the Power Wall.

In modern AI server architectures—specifically within chip-to-chip (Die-to-Die) and board-to-board Scale-Up expansion topologies—traditional copper interconnects are rapidly hitting physical ceilings. Signal attenuation, elevated latency, and unsustainable power dissipation have sparked a clear consensus: transitioning from electrical to optical interconnects is mandatory.

To address this challenge, iReach Corp. has forged a deep strategic technical partnership with Brillink Inc. to jointly deliver ultra-efficient optical interconnect solutions tailored for next-generation AI infrastructures.

Core Engine: Wafer-Bonding Flip-Chip Micro VCSEL Arrays Powering Brillink's OE Engine

Brillink specializes in advanced Silicon Photonics and Co-Packaged Optics (CPO) architectures. To optimize transmission across varying distances, Brillink employs InP for Scale-Out, and leverages Micro LED and Micro VCSEL as light sources for short-to-medium-distance Scale-Up transmission. Micro LED offers key advantages such as ultra-low power consumption, while Micro VCSEL serves as an excellent option for light collimation and speed. At the core of Brillink’s innovation is its world-class Avalanche Photodiode (APD) sensor integrated into an advanced Optical-Electro Engine (OE Engine). This system extends the transmission distance of sub-1000 nm wavelengths while reducing energy consumption to under 1 pJ/bit, delivering superior cost-efficiency and scalability.

A stable, highly dense light source is essential to maximize OE Engine efficiency. For this partnership, iReach supplies its cutting-edge Wafer-Bonding Type Flip-Chip Micro VCSEL Array technology. Compared to legacy wire-bonded emitters, the Flip-Chip structure offers major technical advantages:

• Low Parasitic Inductance & Ultra-High Bandwidth: Shortened electrical interconnects minimize signal distortion under high-speed data modulation.
• High-Density 2D Array Driving Architecture: Dual-layer routing achieves multi-channel output and independent channel control within a compact die footprint.
• Streamlined Fiber Coupling Integration: Vertical backside emission and semiconductor-grade dimensional precision allow direct, seamless coupling with Fiber Array Units (FAUs), lowering assembly complexity and cost.

Redefining Next-Gen AI Infrastructure in Scale-Up Scenarios

By integrating iReach’s high-performance Wafer-Bonding Flip-Chip Micro VCSEL arrays into Brillink’s APD-based OE Engine, the joint solution achieves industry-leading optical efficiency, ultra-low latency, high bandwidth density, and lower total cost of ownership. This significantly reduces power dissipation during Scale-Up data transmission while establishing a solid foundation for volume production of CPO and high-density optical modules.

Accelerating into the Era of Optical Computing

Because Micro VCSELs deliver superior optical power density compared to LEDs, they are ideally suited for 10m+ Scale-Up interconnects, perfectly complementing Micro LED technologies. Combining iReach’s device-level Micro VCSEL mastery with Brillink’s expertise in Silicon Photonics IC design and advanced packaging will propel optical interconnects from concept into volume commercial deployment, driving the next wave of global AI computing power.

【About iReach】

Founded in 2018, iReach Corp. specializes in VCSEL epitaxial structure design, chip optimization design, process development, and wafer-level optical integration packaging tailored for specific application scenarios. Through more than 8 years of dedicated market cultivation, iReach has established itself as a representative Taiwanese supplier in the consumer electronics sensing market, offering products such as Proximity Sensors, iToF, and dToF. In biomedical applications, the company has developed red VCSEL products and demonstrated superior performance in specialized applications using its patented, proprietary wafer-bonding VCSEL Flip-Chip technology.

Leveraging the experience gained from over 1 billion shipped units and backed by its proprietary technology platform, iReach is now allocating new development resources to advance into Micro VCSELs for Silicon Photonics Scale-up applications. For more information, please visit www.ireachcorp.com

【About Brillink】

Founded in 2025, Brillink specializes in AI-driven high-speed optical communications and silicon photonics, delivering comprehensive Scale-Out (120-channel 2D array PIC PDK/ADK) and Scale-Up (sub-0.5 pJ/bit integration via ultra-collimated Micro LEDs, VCSELs, and high-sensitivity APDs) solutions alongside global supply chain partners. Guided by its vision, "Connecting Intelligence at the Speed of Light," Brillink provides end-to-end system designs to power next-generation AI and data center infrastructure. For more information, please visit www.brillink.ai.

【Press Contact】

iReach Corp.
Elaine Cai
+886-3-5789777 # 1239
elaine_cai@ireachcorp.com

Brillink
Linda Wu
+886-3-5601100 # 301
linda.wu@brillink.ai